Technical Seminar Information
The 17th Toshiba Machine Group Solution Fair 2019 has ended.
Thank you for many visits.
Technical seminar
May 23 ( Thu. )
Venue/Time |
Hall 1
Reception,Business Meeting Site / 2nd floor Auditorium A |
Hall 2
Factory 8 B |
Hall 4
Technical Center 1, 3rd floor C |
Hall 8
Gotemba Factry |
---|---|---|---|---|
A | B | C | ||
10:00 - 10:30 |
Nano Processing System Division
State-of-the-art milling technology "High-precision mold machining technology one step ahead" |
Control Systems Division
Proposing dual arm robots that can collaborate with humans New high-speed, high -precision SCARA Robots to cover more various applications |
FUJI SEIKI MACHINE WORKS, LTD.
Roles of wet blasting machines in semiconductor manufacturing |
Technology and Quality Department
Machine Tool Division
Machine Tool Division |
10:45 - 11:15 |
Injection Molding Machine Division
High added value production realized by cooperation between EC-SXⅢand IoT |
IT Promotion Division
Introduction to machiNet |
Extrusion Machine Division
Introduction to patterned film forming using Roll-to-Roll type imprinting machines |
|
11:30 - 12:00 | - |
Control Systems Division
Servo system and programmable logic controllers to optimize machine |
Extrusion Machine Division
Introduction to orientation technology suitable for high-quality, high-performance film forming |
|
12:45 - 13:15 |
IT Promotion Division
Toshiba Machine's approaches to AI |
Extrusion Machine Division
Introduction to the Twin-Screw Extruder TEM series |
Technology and Quality Department
Connecting the same or different materials with FSW |
|
13:30 - 14:00 | - |
Nano Processing System Division
State-of-the-art, ultra-precision machining system |
Injection Molding Machine Division
Approaches to reduce defects during injection molding to zero |
|
14:15 - 14:45 | - |
Toshiba Machine Engineering Co., Ltd.
In-line decorating system: Proposing the jetting style to cover various materials from highly viscous ones to solvents |
Die Casting Machine Division
Approaches to auto body parts and other thin, difficult-to-cast materials |
|
15:00 - 15:30 | - |
SHIBAURA SEMTEK CO., LTD.
Evaluation cases of metal and polymer materials |
Die Casting Machine Division
To making die casting plants smart with IoT |
May 24 ( Fri. )
Venue/Time |
Hall 1
Reception,Business Meeting Site / 2nd floor Auditorium A |
Hall 2
Factory 8 B |
Hall 4
Technical Center 1, 3rd floor C |
Hall 8
Gotemba Factry |
---|---|---|---|---|
A | B | C | ||
10:00 - 10:30 |
Injection Molding Machine Division
Approaches to reduce defects during injection molding to zero |
SHIBAURA SEMTEK CO., LTD.
Evaluation cases of metal and polymer materials |
Extrusion Machine Division
Introduction to patterned film forming using Roll-to-Roll type imprinting machines |
Machine Tool Division
Machine Tool Division
Technology and Quality Department
|
10:45 - 11:15 |
Nano Processing System Division
State-of-the-art, ultra-precision machining system |
Control Systems Division
Proposing dual arm robots that can collaborate with humans New high-speed, high -precision SCARA Robots to cover more various applications |
Die Casting Machine Division
To making die casting plants smart with IoT |
|
11:30 - 12:00 | - |
Nano Processing System Division
State-of-the-art milling technology "High-precision mold machining technology one step ahead" |
Die Casting Machine Division
Approaches to auto body parts and other thin, difficult-to-cast materials |
|
12:45 - 13:15 |
IT Promotion Division
Introduction to machiNet |
Toshiba Machine Engineering Co., Ltd.
In-line decorating system: Proposing the jetting style to cover various materials from highly viscous ones to solvents |
Injection Molding Machine Division
High added value production realized by cooperation between EC-SXⅢand IoT |
|
13:30 - 14:00 | - |
Extrusion Machine Division
Introduction to the Twin-Screw Extruder TEM series |
Technology and Quality Department
Connecting the same or different materials with FSW |
|
14:15 - 14:45 | - |
Extrusion Machine Division
Introduction to orientation technology suitable for high-quality, high-performance film forming |
FUJI SEIKI MACHINE WORKS, LTD.
Roles of wet blasting machines in semiconductor manufacturing |
|
15:00 - 15:30 |
Control Systems Division
Servo system and programmable logic controllers to optimize machine |
IT Promotion Division
Toshiba Machine's approaches to AI |
- |
May 25 ( Sat. )
Venue/Time |
Hall 1
Reception,Business Meeting Site / 2nd floor Auditorium A |
Hall 2
Factory 8 B |
Hall 4
Technical Center 1, 3rd floor C |
Hall 8
Gotemba Factry |
---|---|---|---|---|
A | B | C | ||
10:00 - 10:30 |
Extrusion Machine Division
Introduction to the Twin-Screw Extruder TEM series |
Nano Processing System Division
State-of-the-art milling technology "High-precision mold machining technology one step ahead" |
Injection Molding Machine Division
High added value production realized by cooperation between EC-SXⅢand IoT |
Machine Tool Division
Machine Tool Division
|
10:45- 11:15 |
Control Systems Division
Proposing dual arm robots that can collaborate with humans New high-speed, high -precision SCARA Robots to cover more various applications |
Nano Processing System Division
State-of-the-art, ultra-precision machining system |
Injection Molding Machine Division
Approaches to reduce defects during injection molding to zero |
|
11:30- 12:00 | - |
Extrusion Machine Division
Introduction to orientation technology suitable for high-quality, high-performance film forming |
- | |
12:45 - 13:15 | - |
Control Systems Division
Servo system and programmable logic controllers to optimize machine |
Die Casting Machine Division
To making die casting plants smart with IoT |
|
13:30 - 14:00 | - |
Die Casting Machine Division
Approaches to auto body parts and other thin, difficult-to-cast materials |
- |