Laser Dicing Machine ULD-6A

ULD-6A
ULD-6A

The C2D® (Crack Control Dicing) method is internal reforming modification machining process, which focuses the laser beam inside the substrate to form modified layer and generate a crack on the substrate surface.
The C2D® method sets the laser irradiation pattern pulse-by-pulse by high-speed on-off switching, and optimizes laser pulse energy and focusing point at each user level to generate smooth and successive cracks on the substrate surface.
Generating successive cracks on the surface saves a lot of breaking force and improves the efficiency percentage in the breaking process. (C2D® is a registered trademark of Shibaura Machine)

Applications

Machining Examples
Machining Examples
  • Laser scribing of sapphire substrates for LED

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