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High Precision Dicing Machine
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The dicing machine operability has been integrated in the slicing machine USM with an established reputation for machining performance.
Recent machines have been required to machine workpieces whose materials are more and more difficult to be machined. In such an industrial environment, the high precision dicing machine offers afford environment for machining in addition to providing performance that is easier for operators.

Dicing of SiC wafer
Dicing of multi-layer filter
Dicing of SiC wafer Dicing of multi-layer filter

USM-6E USM-8D

 

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