Laser Dicing Machine ULD-6A

Machining Examples

t150µm Sapphire substrate

t150µm Sapphire substrate
Cleavage line quality of intersection (after breaking) Machining quality of cross section

t250µm Sapphire substrate

t250µm Sapphire substrate
Crack line quality of intersection (before breaking) Machining quality of cross section

t150µm Sapphire substrate with reflecting metal film on its back surface

t150µm Sapphire substrate with reflecting metal film on its back surface
Machined surface (before breaking) Edge quality after chipping

Reflecting metal film properties: Gold (vapor deposition) film thickness: 0.5µm Reflection coating removal width: 20µm

t400µm Quartz substrate

t400µ Quartz substrate
Cleavage line quality of intersection (after breaking) Machining quality of cross section

t650µm Hardened glass

t650µm Hardened glass
Cleavage line quality of intersection (no breaking)

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