Laser Dicing Machine ULD-6A
Features
C2D® Method
The C2D® (Crack Control Dicing) method is internal reforming modification machining process, which focuses the laser beam inside the substrate to form modified layer and generate a crack on the substrate surface.
The C2D® method sets the laser irradiation pattern pulse-by-pulse by high-speed on-off switching, and optimizes laser pulse energy and focusing point at each user level to generate smooth and successive cracks on the substrate surface.
Generating successive cracks on the surface saves a lot of breaking force and improves the efficiency percentage in the breaking process.
(C2D® is a registered trademark of Shibaura Machine)
Multi-Laser Scribing (provisional name)
For the substrate that has reflection coating on the laser radiation side, only one machine can remove reflection coating and process internal modification consecutively.
For the LED substrate with reflection coating, internal modifying process for cracking is also available, which enables producing high-quality chips with high-efficiency of processing.
